drying ovens

Complies with IPC/JEDEC J-STD-033, which details recommendations for handling, packing, shipping and use of moisture/reflow sensitive surface mount devices.

Active desiccant cabinets offer the best solution

Eliminate 'popcorning' and micro-cracking of ICs and BGAs during reflow by using Active Desiccant component drying and storage, rather than baking.

Drying out the components resets the 'Floor Life' clock

There is no Status light bar or audible alarm on this unit but RH is permanently displayed on the front panel

Single Door Humidity Cabinet (AD-101)
drying ovens

Main Features

	No need for moisture barrier bags, nitrogen, compressed air.
	Less complicated than baking: Reduces oxidation.
	Can use low temperature packaging.
	Suitable for compliance with IPC/JEDEC standard J-STD-033B.
	Meter for internal humidity and temperature included.
	Very accurate humidity display +/-1%RH (Normally only +/-3%RH with our competitors!)
	No 'Off' time. The desiccant will always be absorbing moisture.
	Continually regenerating molecular sieve desiccant.
	Fast recovery time after a door is opened (2 minutes).

If moisture is absorbed from the environment by surface mounted components, and then the components are exposed to high temperatures, as in solder reflow ovens(convection, infrared, IR/convection, vapour phase, hot air rework tools), then the absorbed moisture will expand rapidly, causing internal device stress. The resulting stress can cause internal or external cracking, delamination, and internal corrosion.

Blundell Production Equipment - 203 Torrington Avenue, Coventry. CV4 9UT