Other Hot-Plate options IRHP-100

IRHP-100A Hotplate / Base-heater

The newest addition to the i-CON C workbench family is the infrared heating plate 0IRHP100A-03. The proven IR heating plate which comes directly out of ERSA’s world renowned IR rework product line, now offers bottom-side preheating for hand soldering, de-soldering and touch-up applications.

See also HP200A

Product Description

IRHP100A Hot-plate/Base heater

The newest addition to the i-CON C workbench family is the infrared heating plate IRHP100A-03. The proven IR heating plate which comes directly out of ERSA’s world renowned IR rework product line, now offers bottom-side preheating for hand soldering, de-soldering and touch-up applications.

The safe yet powerful medium wave-length IR heating technology offers a tremendous benefit to today’s workbench. Working temperatures of both the soldering iron, heated SMD tweezer and/or de-soldering iron can be greatly reduced.

Lower tip temperatures decrease the risk of PCB damage while at the same time greatly increasing the lifetime of the tips.

The IRHP heating plate is controlled by either the i-CON1 C or the i-CON2 C. This means that operators can customize their workbench by choosing the proper tool for their application – 150 W i-Tool soldering iron, the Chip Tool heated tweezers for SMDs or the 120 W X-Tool for through-hole de-soldering.

Additionally, ERSA offers three different options for PCB handling depending on the application and the size of the PCB. The large digital display & user-friendly menu control of the i-CON C offers maximum process control in 10 languages.

Characteristics:

  • Non-contact preheating of assemblies during lead-free hand soldering
  • Preheating of SMD components and assemblies
  • Heating area: 125 mm x 125 mm (5 ” x 5″)
  • Reflow soldering of one-sided boards
  • Hardening and drying of pastes, lacquers, glues, etc
  • Adjustable heating plate – 6 level

Application range:

  • Preheating of SMD components and assemblies
  • Hardening and drying of pastes, lacquers, glues, etc
  • Reflow soldering of one-sided boards
  • Preheating of BGA components to prevent pop-corning
  • Uniform BGA reflow for re-balling applications

IRHR100HP Rework station – Uses the same heating plate

Hybrid Rework Station

Is also used in conjunction with the very latest in hybrid rework technology, the IRHR100HP