pa510-details
Laser centering
The CyberOptics laser centering system uses a laser diode to project a laser beam onto the component. The component is aligned by rotating the part and analysing the resulting shadow length. The centering mechanism is attached to the placement head and aligns the components while the head is moving from the pickup point to the placement position.
The laser centering system can handle components from 0402 chips up to 30×30 mm in size and 0.5 mm in pitch.
Optical centering
To align components such as FP / BGA / CSP / µBGA or custom parts up to 50×50 mm and a pitch of 0.4 mm, the fixed camera system is used. It measures each pin or outer edge and calculates the corresponding correction factor.
SmartFEEDER®
SmartFEEDERS® are intelligent feeders, that are equipped with a microprocessor control. Using a wireless barcode reader, the reel and the feeder barcode are programmed and saved in the software. See separate page on feeders.
Automatic Fiducial Recognition
This feature automatically recognises preset fiducial points on a circuit board. This is especially useful for inline systems. This is done using a dot, cross, or other mark on the circuit board.
Teach-In
If no CAD data is available to create a new assembly project, each position can be taught manually. See separate page on Software.
CAD Data Converter
With the universal CAD data converter, you can import data from all common CAD programs in a few simple steps. Offline programming is available - see separate page on software.
In-line Production
By removing the feeders from the sides of the machine, it can be placed in line with linking conveyors, screen printer and reflow oven. This reduces the maximum number of feeders from 200 to 100.
Dispensers
Dispensing of solder paste or glue can be done with two different systems:
Time-pressure dispensing system
For dispensing solder paste or glue dots.
Microprocessor-controlled system
This system detects parameters like cartridge temperature, fill level etc. . It can dispense amounts from 0.001 to 10 mm³. Fine-Pitch components down to a pitch of 0.5 mm can be safely dispensed, the ideal solution for prototypes.
