HA-08 Batch reflow Oven

             

HA-08 Batch reflow 

Features

• Hot air / quartz oven
• Outstanding reflow soldering quality for SMD and hybrid
• Cures SMD adhesives
• Two heating zones
• Microprocessor controlled

Technical information

• Power requirements
• Single phase 208/240 V. 50/60 Hz
• Rated power max. 3950 W
• Max. substrate surface: 440 mm x 360 mm
• Two heating zones, microprocessor controlled
• Preheat time: 0-999 sec
• Preheat temp: 60-160°C
• Reflow time: 0-999 sec
• Reflow temp: 90-300°C
• Heat up time to thermal stabilization: approx. 10 min
• Net weight: 34 kg

Options

• Fume Extraction cowl 
• Connection inert gas N2