TWS-850 Batch Reflow & Baking Oven
TWS 850 / 850N2
Batch Reflow Ovens (Extraction Cowl is optional)
Is a powerful and compact reflow and convection oven with one heating zone ideal to perform soldering operation for small to prototype size SMT manufacturing, to cure adhesive and pastes and to remove humidity from fine pitch parts prior to reflow using Hot Bake function.
Features
- The oven enables to solder boards up to 330 mm length and 240 mm widht. Heating of the board is obtained by forced convection of hot air, a well-proven system, giving the best compromise among quality, productivity, consumption and dimensions
- The oven enables to solder boards up to 330 mm length and 240 mm width
- Heating of the board is obtained by forced convection of hot air, a well-proven system, giving the best compromise among quality, productivity, consumption and dimensions
- Gentle forced convection ensures uniform heating without the danger of disruption to component placement
- Easy to use and with good performance
- Powerful enough to produce perfect results in in short cycle times even on a large pcb
- Bench-top model ideal for small production, prototyping and laboratory work
- The electronic control system is designed to minimise power consumption
- High variety of thermal profile attainable
- The actual temperature of the heater is monitored by computer and a built-in K-type thermocouple
- The oven’s main parameters are constantly monitored by the Touch screen LCD display
- Display show:
- Temperature set-point for each heating phase
- Actual temperature for each heating phase
