IBL-VAC 645 Vapour Phase Reflow
IBL Vac 645 Vacuum Vapour Phase
The popularity of Vacuum Vapour Phase has increased in recent years due to the increased complexity of high Tech assemblies. IBL’s vacuum vapour phase systems are especially effective in eliminating voids, and improving the wetting properties of the assemblies.
The combination of IBL’s unique ‘soft vapour phase’ technology and the negative pressure applied by the vacuum while the solder is still in a liquid state substantially improves the soldering results when complex assemblies are being processed.
Features:
- Controllable high power vacuum process
- Void free solder joints even on large areas
- SVTC soft vapour temperature control
- Rapid cooling system
- Very low Galden consumption
- Observation window in process chamber
- Real time temperature monitoring
Other Reflow Options
Convection Reflow Other Vapour Phase
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