IBL SLC509 Vapour Phase Reflow

                      

IBL SLC509 Vapour Phase Reflow

Premium Series

The Premium-Series has been designed for any type of 

soldering demand. Additionally features compared to the Economy-Series increase the flexibility and scope of the machines. The Premium-Series is available in a wide range of machine sizes.

Handling

The loading and unloading of the Inline-machines is conducted outside the process chambers, ensuring trouble-free production.

In-line module (patented)

The batch machines can be upgraded to fully automated in-line production, enabling the machine in a production line next to pick & place equipment. Multiline loading of the carrier is possible. More flexibility can be achieved by using a batch carrier additionally during the in-line operation.

Soft Vapour Phase (SVP) (patented)

The SVP process mode enables variable temperature profile adjustments for a wide range of soldering demands. An adjusted temperature profile with (e.g. 1K/sec.) can prevent the so-called tombstone effect of passive components.

Temperature profile

The patented Soft Vapour Phase (SVP) allows adjustment of temperature profiles to nearly any required temperature gradient. For less demanding requirements the user can select the HL-mode. Safe soldering for leadfree solder can be achieved with up to max. 230°C.

For more exacting specification the SVP-mode enables the user to create e.g. "Plateau"-profiles or to generate low temperature gradients. With IRheaters(optional) process optimisation or glue curing can be achieved. It is possible to monitor the process data with the IBLsoftware VP-Control.

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