IBL SLC309 Vapour Phase Reflow
Premium Vapour Phase Soldering Series
IBL SLC 309 / SLC 509 Vapour Phase Reflow Systems
With the introduction of Soft Vapour Phase technology, IBL is able to create an infinite variety of temperature profiles within the Vapour chamber.
The process is controlled by temperature set points and cannot exceed the maximum programmed temperature or the boiling point of the fluid.
Soft Vapour Phase mode allows the assembly to be moved lower or higher within the vapour and to hold in different positions. This unique feature of IBL machines creates repeatable temperature profiles for varying applications
- Maximum process window at minimum temperature
- Real time temperature monitoring and recording
- SVTC Soft-Vapour temperature control
- Rapid Cooling system
- Energy Management for lowest power consumption
- Very low Galden usage
- Observation window for process viewing.
Other Reflow options
Hotflow 2/12 reflow tunnel oven SV260 Vapour phase reflow
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