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| The RPC module allows for real time viewing at high magnification of solder-melt and true reflow (Double-drop) and uses a new high-power (up to 300x enlargement) motor zoom camera, a controllable LED ring lighting system, and an extremely robust, movable stand. The reflow process can be visualised from multiple angles on even the smallest of components and due to it's very small eris can view between gaps as small as 5mm to see components leads or ball behind. |
| The PL 650 A is the second generation precision placement system designed for the largest range of components (from 1 x 1 mm to 60 x 60 mm in size), more automation, and greater repeatability. A high-resolution camera with motor zoom permits highly precise alignment of component connections to lands with up to 300x enlargement. The excellent image quality is supported by a high-contrast, separately controlled 2 color LED lighting system from four sides. The Auto Pick & Place mode guarantees repeatable and precise (+/- 0.010 mm accuracy) results. |
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